Prime Minister Datuk Seri Anwar Ibrahim confirmed today, March 17, 2026, that global technology leader Intel Corporation is expanding its presence in Malaysia with a new advanced packaging and assembly complex. Following a briefing from Intel’s leadership, the Prime Minister highlighted that the facility is set to commence operations later this year. This strategic investment is aimed at strengthening Malaysia's role in the global semiconductor supply chain, particularly in high-value segments like testing and advanced assembly. 

The Prime Minister emphasized that this expansion is a significant boost to the Madani Economy, as it focuses on creating high-value employment opportunities for local talent. The discussions between the government and Intel centered on supporting the development of this complex, which forms the core of the company's long-term investment strategy in the region. This move reinforces Malaysia's status as a preferred hub for semiconductor manufacturing amidst growing global demand for advanced computing hardware.

In addition to industrial growth, the investment includes a commitment to the continuous upskilling of the local workforce to meet international standards in the tech industry. By integrating more sophisticated manufacturing processes, Malaysia aims to move up the value chain and foster a more resilient economic ecosystem. This announcement follows a rare stretch of political stability that has increasingly attracted global funds to Malaysian assets, positioning the country as a standout performer among its Southeast Asian peers.